The Higher Education Loans Board (HELB) has opened applications for its 2026/2027 partial postgraduate scholarship programme, offering financial support of up to Sh450,000 to eligible Kenyan students pursuing Master’s and Doctor of Philosophy (PhD) studies.
The scholarship programme is designed to ease the financial burden of advanced university education while supporting the country’s investment in high-level skills development.
According to HELB, the scholarships are available to Kenyan students enrolled in Master’s and PhD programmes at both public and private universities accredited by the Commission for University Education (CUE).
Under the programme, successful Master’s students will receive Sh200,000, disbursed over two years, while PhD candidates will be awarded Sh450,000, payable over a three-year period.
The scholarships are targeted at students pursuing courses in Science, Technology, Engineering and Mathematics (STEM) as well as agriculture-related disciplines, which the board says are critical to advancing Kenya’s industrialisation, innovation and food security goals.
To qualify for the scholarship, applicants must have attained at least a Second Class Upper Division in their undergraduate studies and possess a valid admission letter from a university recognised by the Commission for University Education.
HELB further stated that applicants who previously benefited from its loan programme must be actively servicing their loans or have fully cleared any outstanding balances before they can be considered for the scholarship.
Applicants will also be required to pay a non-refundable application fee of Sh3,000 through the eCitizen platform. The board encouraged persons living with disabilities to submit their applications.
At the same time, HELB warned prospective applicants to remain vigilant against fraudsters purporting to influence or expedite scholarship awards.
“The selection process is fully automated,” the board said, urging applicants to disregard individuals claiming they can secure or fast-track scholarships in exchange for payment or other favours.
The application window will remain open until August 31, 2026.
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